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#News(IoTStack) [ via IoTForIndiaGroup ]
STMicroelectronics has introduced a matched balun for its S2-LP 868-927MHz low-power radio transceiver to help engineers save board space and minimize RF-circuit design challenges in size- and cost-conscious products like IoT sensors, smart meters, alarms, remotes, building automation, and industrial controls.
The 3.26mm2 BALF-SPI2-01D3 integrates all the impedance-matching and filtering components needed to connect an antenna to the S2-LP radio, replacing a conventional network of 16 discrete capacitors and inductors that can occupy up to 100mm2 of board real-estate — a footprint reduction of more than 96%.In addition to saving space, circuit design is greatly simplified, with no need to select component values or tackle exacting layout challenges. Fully optimized for the S2-LP, the balun comes with placement and connection recommendations that are tested and verified and can be directly replicated to maximize RF performance.
The BALF-SPI2-01D3 is the latest in ST’s family of integrated baluns. There are now 16 devices, in package sizes down to 0.8mm2 and just 0.56mm high after reflow, for use with ST’s sub-1GHz or Bluetooth® low energy 2.4GHz radios, as well as with various transceivers from other manufacturers.
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