A New Advanced IC Packaging Battlefield

› Forums › IoTStack › News (IoTStack) › A New Advanced IC Packaging Battlefield

Tagged: 

  • This topic has 1 voice and 0 replies.
Viewing 0 reply threads
  • Author
    Posts
    • January 28, 2019 at 5:39 am #27592
      TelegramGroup IoTForIndia
      Moderator
      • Topic 2519
      • Replies 0
      • posts 2519
        @iotforindiatggroup

        #News(IoTStack) [ via IoTForIndiaGroup ]

        Today, advanced packaging technology has created a new battleground where 2.5D packaging and heterogeneous design drive constraints that span semiconductor, packaging, board, and even system-level design. In this episode of Chalk Talk, Amelia Dalton chats with John Park of Cadence Design Systems about new techniques and tools for advanced IC packaging design.

    • Author
      Posts
    Viewing 0 reply threads
    • You must be logged in to reply to this topic.